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Bergquist Gap Pad 2200SF不含硅的間隙填充導(dǎo)熱材料
材料生產(chǎn)商:美國(guó)貝格斯(BERGQUIST)公司研發(fā)產(chǎn)品
Gap Pad 2200SF可供規(guī)格:
厚度(Thickness): 0.25mm 0.51mm 1.02mm 1.52mm 2.03mm 2.54mm 3.18mm
片材(Sheet): 8”×16”(203 mm *406 mm)
卷材(Roll):無(wú)
導(dǎo)熱系數(shù)(Thermal Conductivity): 2.0W/m-k
基材(Reinfrcement Carrier):玻璃纖維
膠面(Glue):雙面自帶粘性
顏色(Color):綠色
包裝(Pack):原裝進(jìn)口包裝
抗擊穿電壓(Dielectic Breakdown Voltage)(Vac): >5000
持續(xù)使用溫度(Continous Use Temp):-60°~200°
Gap Pad 2200SF應(yīng)用材料特性:
Gap Pad 2200SF是無(wú)硅配方,服貼度適中,易于加工具有電氣絕緣性能。
Gap Pad 2200SF材料說(shuō)明:
Gap Pad 2200SF是一款不含硅的高分子聚合物導(dǎo)熱絕緣材料,專(zhuān)為對(duì)硅敏感的應(yīng)用而設(shè)計(jì),該材料特別適合填充不平整和高累積公差的間隙。
玻璃纖維基材使其易于加工,加強(qiáng)了裝配時(shí)的耐用性,該材料供貨時(shí)附帶了雙面保護(hù)離型膜,材料的正面粘性比弱,能經(jīng)受老化測(cè)試,而且易于重工。
Gap Pad 2200SF典型應(yīng)用:
光驅(qū),直流換向器電動(dòng)機(jī),連接器,繼電器,光纖模塊
Gap Pad 2200SF技術(shù)優(yōu)勢(shì)分析:
Gap Pad 2200SF是貝格斯公司推出的又一款無(wú)硅膠導(dǎo)熱片,相對(duì)于Gap Pad 1000SF材料,Gap Pad 2200SF的性能有了非常大的提升。其導(dǎo)熱系數(shù)已經(jīng)達(dá)到了2.0W。完全可以滿(mǎn)足對(duì)硅敏感的元器件的散熱需求。是非常不錯(cuò)的選擇。
Gap Pad 2200SF is a thermally conductive, electrically isolating, silicone-free polymer specially designed for silicone-sensitive applications.The material is ideal for applications with uneven topologies and high stackup tolerances. Gap Pad 2200SF is reinforced for easy material handling and added durability during assembly.The material is available with a protective liner on both sides. Gap Pad 2200SF is supplied with reduced tack on one side allowing for burn-in processes and easy rework
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