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Bergquist GapPad2500S20超低壓力應(yīng)用間隙填充導(dǎo)熱材料

材料生產(chǎn)商：美國貝格斯（BERGQUIST）公司研發(fā)產(chǎn)品

GapPad2500S20可供規(guī)格：

厚度(Thickness)：0.25mm 0.51mm 1.02mm 1.52mm 2.03mm 2.54mm 3.18mm4.06mm 5.08mm 6.35mm

片材(Sheet)：8”×16”（203×406 mm）8.4”×19”(213.36×482.6mm)

卷材(Roll)：無

  導(dǎo)熱系數(shù)(Thermal Conductivity)：2.4W/m-k

  基材(Reinfrcement Carrier)：玻璃纖維

膠面(Glue)：雙面自帶粘性

顏色(Color)：淺黃色

包裝(Pack)：美國原裝進(jìn)口包裝

抗擊穿電壓(Dielectic Breakdown Voltage)（Vac）:＞3000

持續(xù)使用溫度（Continous Use Temp）：-60°~200°

 GapPad2500S20特點(diǎn)和好處

Gap Pad 2500S20 is a thermally conductive, reinforced material rated at a thermal conductivity of 2.4 W/m-K.The material is a
filled-polymer material yielding extremely soft, elastic characteristics.The material is reinforced to provide easy handling, converting, added electrical isolation and tear resistance. Gap Pad 2500S20 is well suited for lowpressure applications that typically use fixed standoff or clip mounting.The material maintains a conformable, yet elastic nature that allows for excellent interfacing and wet-out characteristics, even to surfaces with high roughness and/or topography.
Gap Pad 2500S20 is offered with inherent natural tack on both sides of the material allowing for stick-in-place characteristics during application assembly. It is also available with a non-tack side. Please see the “Standard Options” section for description. The material is supplied with protective liners on both sides.The top side has reduced tack for ease of handling.

GapPad2500S20技術(shù)優(yōu)勢分析：

GapPad2500S20是額定熱傳導(dǎo)率為2.4W/mK增強(qiáng)的導(dǎo)熱材料。這種材料由超柔軟的填充聚合物構(gòu)成，增強(qiáng)了易加工性，轉(zhuǎn)換性，電氣絕緣性和抗撕裂性。這種材料被典型的用做螺絲固定或者夾子固定的低緊固壓力的應(yīng)用，它的彈性特性和貼服性能決定了其優(yōu)良的界面潤濕特性，從而保持高度粗糙的或者平整界面一致。GapPad2500S20在裝配的過程中兩邊用螺絲釘自然固定，從而固定其位置。材料的兩邊都有保護(hù)襯墊保護(hù)。

GapPad2500S20典型應(yīng)用

處理器和散熱器之間、圖形芯片和散熱器之間、硬盤，DVD，CDROM電子冷卻、需要傳熱的框架，底盤或者其它需要熱轉(zhuǎn)移的區(qū)域。